Taiwan Semiconductor Manufacturing Company
TSMpublicchipmakerSemiconductors (Foundry)
World's largest contract chipmaker — manufactures virtually all advanced AI chips (NVIDIA H/B series, Apple silicon, AMD, Qualcomm). TSMC's CAPEX is the best proxy for global AI chip supply capacity. CoWoS advanced packaging for HBM is a key AI bottleneck.
CAPEX, newest quarter · 2025 Q4
$11.20B
Typed by hand, from TSMC Q4 2025 Earnings (est.): the rules read CAPEX from a company's own reports, and TSMC is not among the 37 companies they cover.
- Off the balance sheet →what it owes that its balance sheet does not carry, each fact counted once · verified 2026-09-28
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- Notes priced since 2024 →each tranche in the ledger as the company itself states it
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- Loans and credit facilities →new facilities as signed, from the company's own announcements
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- Debt due in 12 months →the company's own five-year schedule
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- Documents in the corpusthe company's own reports, announcements and earnings calls that the rules read
- 4
CAPEX by quarter · typed by hand
Typed by hand before the pipeline, each quarter from the document named in the table below: the rules read CAPEX from a company's own reports, and TSMC is not among the 37 companies they cover.
Every quarter · typed by hand
16 rowstyped by hand
Typed by hand before the pipeline: the rules read CAPEX from a company's own reports, and TSMC is not among the 37 companies they cover.
| 2025 Q4 | $11.20B | $33.00B | 33.9% | TSMC Q4 2025 Earnings (est.) Estimated. FY2025 total est. ~$42.5B |
| 2025 Q3 | $11.00B | $30.00B | 36.7% | TSMC Q3 2025 Earnings (est.) Estimated. N2 ramp driving CAPEX acceleration. |
| 2025 Q2 | $10.80B | $28.00B | 38.6% | TSMC Q2 2025 Earnings Converted from TWD at 32 TWD/USD |
| 2025 Q1 | $9.50B | $25.50B | 37.3% | TSMC Q1 2025 Earnings Converted from TWD at 32 TWD/USD |
| 2024 Q4 | $7.20B | $26.90B | 26.8% | TSMC Q4 2024 Earnings FY2024 total CAPEX: ~$30.0B |
| 2024 Q3 | $7.80B | $23.50B | 33.2% | TSMC Q3 2024 Earnings Converted from TWD at 31 TWD/USD |
| 2024 Q2 | $7.70B | $20.80B | 37.0% | TSMC Q2 2024 Earnings Converted from TWD at 31 TWD/USD |
| 2024 Q1 | $7.30B | $18.90B | 38.6% | TSMC Q1 2024 Earnings Converted from TWD at 31 TWD/USD |
| 2023 Q4 | $7.00B | $19.60B | 35.7% | TSMC Q4 2023 Earnings FY2023 total CAPEX: ~$27.0B (discipline after 2022 surge) |
| 2023 Q3 | $6.90B | $17.30B | 39.9% | TSMC Q3 2023 Earnings Converted from TWD at 30 TWD/USD |
| 2023 Q2 | $6.80B | $15.70B | 43.3% | TSMC Q2 2023 Earnings Converted from TWD at 30 TWD/USD |
| 2023 Q1 | $6.30B | $16.70B | 37.7% | TSMC Q1 2023 Earnings Converted from TWD at 30 TWD/USD |
| 2022 Q4 | $9.00B | $19.90B | 45.2% | TSMC Q4 2022 Earnings FY2022 total CAPEX: ~$36.3B |
| 2022 Q3 | $9.20B | $20.20B | 45.5% | TSMC Q3 2022 Earnings Converted from TWD at 30 TWD/USD |
| 2022 Q2 | $9.10B | $18.20B | 50.0% | TSMC Q2 2022 Earnings Converted from TWD at 30 TWD/USD |
| 2022 Q1 | $8.80B | $17.60B | 50.0% | TSMC Q1 2022 Earnings Converted from TWD at 30 TWD/USD |
Typed by hand
The first generation of this page, typed before the pipeline from calls, press releases and reports. No rule reads it, and it is not checked the way the figures the rules read are. Methodology →
Guidance tracker
typed by handFY2025
Completed
“We expect our 2025 capital budget to be between $38 billion and $42 billion, driven by N2 capacity build-out, CoWoS advanced packaging expansion, and Arizona fab investments.”
Guided: $38.0B–$42.0BActual to date: $42.5B
112%
FY2026
On Track
Analyst estimate · Analyst estimate — no company statement on record (Jan 2026) · 2026-01-16
Guided: $42.0B–$48.0B
FY2027
Pending
Analyst estimate · Analyst estimate — no company statement on record (2026) · 2026-01-16
Guided: $48.0B–$55.0B
Key quotes
typed by handC.C. Wei·CEO·2025-01-16
“AI-related demand is real and is accelerating. Our CoWoS capacity is sold out through 2025. We are expanding aggressively to meet demand from all our AI customers.”
Q4 2024 Earnings Call · TSMC Q4 2024 Earnings, Jan 2025
Partnerships and investments
typed by handNVIDIA
TSMC manufactures all NVIDIA H100/H200/B100/B200 GPUs on N4/N3 process. CoWoS packaging for HBM integration.
2023-01-01
supply
Apple
Sole foundry for Apple silicon (M-series, A-series). TSMC N3E process for latest chips.
2020-01-01
supply
taiwansemiconductorsfoundryAI-chipsNVIDIACoWoSN2N3public